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Mini Electronics Component Shielded Smd Power Inductors Ultra Low Buzz Noise

    Buy cheap Mini Electronics Component Shielded Smd Power Inductors Ultra Low Buzz Noise from wholesalers
     
    Buy cheap Mini Electronics Component Shielded Smd Power Inductors Ultra Low Buzz Noise from wholesalers
    • Buy cheap Mini Electronics Component Shielded Smd Power Inductors Ultra Low Buzz Noise from wholesalers
    • Buy cheap Mini Electronics Component Shielded Smd Power Inductors Ultra Low Buzz Noise from wholesalers
    • Buy cheap Mini Electronics Component Shielded Smd Power Inductors Ultra Low Buzz Noise from wholesalers

    Mini Electronics Component Shielded Smd Power Inductors Ultra Low Buzz Noise

    Ask Lasest Price
    Brand Name : Shinhom
    Model Number : HQ1108
    Certification : RoHS
    Price : Negotiation
    Payment Terms : T/T
    Supply Ability : 1000000/MONTH
    Delivery Time : 4~8 Weeks
    • Product Details
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    Mini Electronics Component Shielded Smd Power Inductors Ultra Low Buzz Noise


    HQ1108 Series high current power inductors,mini electronics component Custom,Iron core shielded,2.25uH 50A


    FEATURES:
    Lowest DCR/μH
    Height:8mm Max
    Footprint:15.5mm x 11mm Max
    Current Rating:up to 50Apk
    Inductance Range: 0.14µH to 2.25µH
    Handles high transient current spikes without saturation
    Ultra low buzz noise, due to composite construction
    Compliant to RoHS directive 2002/95/EC


    APPLCATIONS:

    • PDA/notebook/desktop/server applications
    • High current POL converters
    • Low profile, high current power supplies
    • Battery powered devices
    • DC/DC converters in distributed power systems
    • DC/DC converter for Field Programmable Gate Array (FPGA)



    NOTES:.

    • Test Frequency : 100KHz / 0.1Vdc
    • Testing Instrument : L:HP4284A, CH11025,CH3302, CH1320, CH1320S LCR METER/Rdc:CH16502, Agilent33420A MICRO OHMMETER.
    • Heat Rated Current (Irms) will cause the coil temperature rise approximately,△T=40℃ without core loss.
    • Saturation Current (Isat) will cause L0 to drop approximately 10%
    • The part temperature (ambient + temp rise) should not exceed 125℃ under worst case operating conditions. Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
    • Operating Temperature: -40℃ - +105℃.
    • Storage Temperature: -40℃ - +105℃.

    Note: Product specifications can be customized.




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